Footprints
16 footprints matching “HSOP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 25
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 13
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 21
- SMD
- 15.9×16.6
- Boards
- 2
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm_ThermalVias
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 2
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 21
- SMD
- 15.9×18.2
- Boards
- —
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 20
- SMD
- 15.9×16.4
- Boards
- —
HSOP-32-1EP_7.5x11mm_P0.65mm_EP4.7x4.7mm
Package_SO
HSOP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT1746-3.pdf)
- Pads
- 33
- SMD
- 11.6×11.5
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×18.2
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×16.6
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
HSOP-54-1EP_7.5x17.9mm_P0.65mm_EP4.6x4.6mm
Package_SO
HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf)
- Pads
- 55
- SMD
- 11.6×18.4
- Boards
- —
Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias
Package_SO
Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 34
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm
Package_SO
Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 5
ABLIC HSOP6-A
celestial-altium-Leaded_SOP
HSOP, 6-Leads, Body 5.02x3.90mm, Pitch 1.91mm, IPC Medium Density
- Pads
- 6
- SMD
- 7.0×5.6
- Boards
- —