Footprints
179 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LFCSP-VQ-24-1EP_4x4mm_P0.5mm_EP2.642x2.642mm
Package_CSP
LFCSP VQ, 24 pin, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf)
- Pads
- 25
- SMD
- 5.1×5.1
- Boards
- —
LFCSP-VQ-48-1EP_7x7mm_P0.5mm
Package_CSP
LFCSP VQ, 48 pin, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html)
- Pads
- 49
- SMD
- 8.1×8.1
- Boards
- —
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
Macronix_WLCSP-12_2.02x2.09mm_Layout4x4_P0.5mm
Package_CSP
WLCSP-12, 2.02x2.09mm, 12 Ball, 4x4 Layout, 0.5mm Pitch, https://www.macronix.com/Lists/Datasheet/Attachments/8909/MX25U3232F,%201.8V,%2032Mb,%20v1.2.pdf#page=93
- Pads
- 12
- SMD
- 4.0×4.1
- Boards
- —
Maxim_WLCSP-35_2.998x2.168mm_Layout7x5_P0.4mm
Package_CSP
WLCSP-35, 2.998x2.168mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF
- Pads
- 35
- SMD
- 5.0×4.2
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
pSemi_CSP-16_1.64x2.04mm_P0.4mm
Package_CSP
pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf)
- Pads
- 16
- SMD
- 2.1×2.5
- Boards
- —
pSemi_CSP-16_1.64x2.04mm_P0.4mm_Pad0.18mm
Package_CSP
pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf)
- Pads
- 16
- SMD
- 2.1×2.5
- Boards
- —
ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm
Package_CSP
ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf
- Pads
- 100
- SMD
- 6.4×6.5
- Boards
- —
ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter
Package_CSP
ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf
- Pads
- 100
- SMD
- 6.4×6.4
- Boards
- —
ST_WLCSP-100_Die422
Package_CSP
WLCSP-100, 4.201x4.663mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f302vc.pdf#page=133
- Pads
- 100
- SMD
- 6.2×6.7
- Boards
- —
ST_WLCSP-100_Die446
Package_CSP
WLCSP-100, 4.775x5.041mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f303zd.pdf#page=162
- Pads
- 100
- SMD
- 6.8×7.1
- Boards
- —
ST_WLCSP-100_Die452
Package_CSP
WLCSP-100, 4.201x4.663mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00330506.pdf#page=218
- Pads
- 100
- SMD
- 6.2×6.7
- Boards
- —
ST_WLCSP-100_Die461
Package_CSP
WLCSP-100, 4.618x4.142mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00284211.pdf#page=259
- Pads
- 100
- SMD
- 6.6×6.2
- Boards
- —
ST_WLCSP-101_3.86x3.79mm_Layout11x19_P0.35mm_Stagger
Package_CSP
ST WLCSP-101, ST Die ID 485, 3.86x3.79mm, 101 Ball, Y-staggered 11x19 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7r3v8.pdf
- Pads
- 101
- SMD
- 5.9×5.8
- Boards
- —
ST_WLCSP-104_Die437
Package_CSP
WLCSP-104, 4.095x5.094mm, 104 Ball, 9x12 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l152ze.pdf#page=127
- Pads
- 104
- SMD
- 6.1×7.1
- Boards
- —