Footprints

65 footprints matching “LA”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

65 footprints · page 1 of 3

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WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm

FP—

Package_CSP

WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf

Pads: 20
SMD: 3.9×4.4
Boards: 3

Anpec_WLCSP-20_1.76x2.03mm_Layout4x5_P0.4mm

FP—

Package_CSP

WLCSP-20, 1.76x2.03mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.lcsc.com/datasheet/lcsc_datasheet_2007032014_Anpec-Elec-APW7261HAI-TRG_C691404.pdf

Pads: 20
SMD: 3.8×4.0
Boards: —

Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm

FP—

Package_CSP

Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet

Pads: 34
SMD: 6.5×3.7
Boards: —

DiodesInc_GEA20_WLCSP-20_1.7x2.1mm_Layout4x5_P0.4mm

FP3D

Package_CSP

Diodes Incorporated WLCSP-20, GEA20, 1.7x2.1mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.diodes.com/assets/Package-Files/GEA20.pdf

Pads: 20
SMD: 3.7×4.1
Boards: —

Efinix_WLCSP-64_3.5353x3.3753mm_Layout8x8_P0.4mm

FP—

Package_CSP

Efinix WLCSP, NSMD pad definition Page 60, 3.5353x3.3753mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf#page=9

Pads: 64
SMD: 5.5×5.4
Boards: —

Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm

FP—

Package_CSP

WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf

Pads: 80
SMD: 6.5×5.6
Boards: —

Macronix_WLCSP-12_2.02x2.09mm_Layout4x4_P0.5mm

FP—

Package_CSP

WLCSP-12, 2.02x2.09mm, 12 Ball, 4x4 Layout, 0.5mm Pitch, https://www.macronix.com/Lists/Datasheet/Attachments/8909/MX25U3232F,%201.8V,%2032Mb,%20v1.2.pdf#page=93

Pads: 12
SMD: 4.0×4.1
Boards: —

Maxim_WLCSP-35_2.998x2.168mm_Layout7x5_P0.4mm

FP—

Package_CSP

WLCSP-35, 2.998x2.168mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF

Pads: 35
SMD: 5.0×4.2
Boards: —

Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm

FP—

Package_CSP

Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf

Pads: 15
SMD: 4.4×3.2
Boards: —

NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm

FP3D

Package_CSP

NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf

Pads: 49
SMD: 5.4×5.4
Boards: —

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

FP3D

Package_CSP

NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf

Pads: 100
SMD: 7.1×7.1
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm

FP—

Package_CSP

ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf

Pads: 100
SMD: 6.4×6.5
Boards: —

ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter

FP—

Package_CSP

ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf

Pads: 100
SMD: 6.4×6.4
Boards: —