Footprints

281 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

281 footprints · page 6 of 12

CERDIP-20_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 10.7×26.0
Boards: 1

DIP-10_W10.16mm_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 10
THT: 13.1×13.2
Boards: 1

DIP-10_W7.62mm_Socket

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 10
THT: 10.7×13.3
Boards: 1

DIP-12_W10.16mm_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 12
THT: 13.1×15.7
Boards: 1

DIP-12_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 12
SMD: 10.7×15.9
Boards: 1

DIP-12_W7.62mm_Socket

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 12
THT: 10.7×15.9
Boards: 1

DIP-12_W7.62mm_Socket_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 12
THT: 10.7×15.9
Boards: 1

DIP-12_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 12
SMD: 12.5×15.9
Boards: 1

DIP-20_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 20
SMD: 12.5×26.0
Boards: 1

DIP-22_W10.16mm

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 22
THT: 12.3×28.4
Boards: 1

DIP-22_W10.16mm_Socket

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket

Pads: 22
THT: 13.2×28.6
Boards: 1

DIP-22_W7.62mm_Socket

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 22
THT: 10.7×28.6
Boards: 1

DIP-24_18.0mmx34.29mm_W15.24mm

FP—

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils) https://www.mouser.at/datasheet/2/389/m48t02-1849963.pdf

Pads: 24
THT: 18.5×34.8
Boards: 1

DIP-24_W10.16mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 24
THT: 12.3×31.0
Boards: 1

DIP-28_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 28
SMD: 20.1×36.2
Boards: 1

DIP-28_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 28
SMD: 12.5×36.2
Boards: 1

DIP-40_W25.4mm_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), LongPads

Pads: 40
THT: 28.3×51.3
Boards: 1

DIP-40_W25.4mm_Socket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket, LongPads

Pads: 40
THT: 28.4×51.4
Boards: 1

DIP-42_W15.24mm_Socket_LongPads

FP3D

Package_DIP

42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 42
THT: 18.3×54.0
Boards: 1

DIP-5-6_W7.62mm

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils)

Pads: 5
THT: 9.8×8.2
Boards: 1

CERDIP-14_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.7×19.7
Boards: —

CERDIP-16_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 10.7×20.9
Boards: —

CERDIP-18_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 18
THT: 10.5×23.4
Boards: —

CERDIP-18_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 18
THT: 10.7×23.5
Boards: —