Footprints
32 footprints matching “11”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-18W_7.5x11.6mm_P1.27mm
Package_SO
SOIC, 18 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf)
- Pads
- 18
- SMD
- 11.9×12.1
- Boards
- 163
Infineon_PG-DSO-12-11
Package_SO
Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/)
- Pads
- 13
- SMD
- 12.1×8.6
- Boards
- 12
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
TSOP-I-28_11.8x8mm_P0.55mm
Package_SO
TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)
- Pads
- 28
- SMD
- 14.9×8.7
- Boards
- 6
TSOP-I-32_11.8x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 32
- SMD
- 14.9×8.5
- Boards
- 4
SOP-18_7.495x11.515mm_P1.27mm
Package_SO
SOP, 18 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=30523)
- Pads
- 18
- SMD
- 11.9×12.0
- Boards
- 3
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 21
- SMD
- 15.9×16.6
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
SOP-32_11.305x20.495mm_P1.27mm
Package_SO
SOP, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 32
- SMD
- 15.7×21.0
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 21
- SMD
- 15.9×18.2
- Boards
- —
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 20
- SMD
- 15.9×16.4
- Boards
- —
HSOP-32-1EP_7.5x11mm_P0.65mm_EP4.7x4.7mm
Package_SO
HSOP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT1746-3.pdf)
- Pads
- 33
- SMD
- 11.6×11.5
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×18.2
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×16.6
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
Infineon_PG-DSO-12-11_ThermalVias
Package_SO
Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/)
- Pads
- 13
- SMD
- 12.1×8.6
- Boards
- —
Renesas_SOP-32_11.4x20.75mm_P1.27mm
Package_SO
Renesas SOP, 32 Pin (https://www.renesas.com/en/document/psc/package-drawing-sop-32pin-prsp0032df)
- Pads
- 32
- SMD
- 15.6×21.3
- Boards
- —
Texas_DAD0032A_HTSSOP-32_6.1x11mm_P0.65mm_TopEP3.71x3.81mm
Package_SO
Texas DAD0032A HTSSOP, 32 Pin (https://www.ti.com/lit/ds/symlink/tpa3116d2.pdf)
- Pads
- 32
- SMD
- 9.5×11.5
- Boards
- —
Texas_DKD0036A_HSSOP-36_11x15.9mm_P0.65mm_TopEP5.85x12.65mm
Package_SO
Texas DKD0036A HSSOP, 36 Pin (https://www.ti.com/lit/ml/pptd185d/pptd185d.pdf)
- Pads
- 36
- SMD
- 15.7×16.4
- Boards
- —
Toshiba_SOIC-4-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 4 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.4pin%20MFSOP6.html)
- Pads
- 4
- SMD
- 8.0×4.1
- Boards
- —
Toshiba_SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 5 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.5pin%20MFSOP6.html)
- Pads
- 5
- SMD
- 8.0×4.1
- Boards
- —
TSSOP-32_6.1x11mm_P0.65mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var DC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 9.4×11.5
- Boards
- —
TSSOP-32_8x11mm_P0.65mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var GB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 11.3×11.5
- Boards
- —