Footprints

1,657 footprints matching “pad”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

1,657 footprints · page 11 of 70

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L_0201_0603Metric_Pad0.64x0.40mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf)

Pads
2
SMD
1.8×0.7
Boards
10

RaspberryPi_Pico_W_SMD_HandSolder

FP3D

Module

Raspberry Pi Pico W surface-mount footprint with debug pads for hand soldering (not compatible with non-wireless Pico), supports Raspberry Pi Pico 2 W, https://datasheets.raspberrypi.com/picow/pico-w-datasheet.pdf

Pads
43
SMD
23.1×53.9
Boards
10

MountingHole_2.7mm_M2.5_ISO7380_Pad_TopBottom

FP—

MountingHole

Mounting Hole 2.7mm, M2.5, generated by kicad-footprint-generator mountinghole.py

Pads
1
THT
5.0×5.0
Boards
10

MountingHole_4.3mm_M4_ISO14580_Pad

FP—

MountingHole

Mounting Hole 4.3mm, M4, generated by kicad-footprint-generator mountinghole.py

Pads
1
THT
7.5×7.5
Boards
10

MountingHole_6mm_Pad

FP—

MountingHole

Mounting Hole 6mm, generated by kicad-footprint-generator mountinghole.py

Pads
1
THT
12.5×12.5
Boards
10

DIP-16_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads
16
SMD
10.7×20.9
Boards
10

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf)

Pads
17
SMD
7.0×5.7
Boards
10

TerminalBlock_MetzConnect_Type094_RT03502HBLU_1x02_P5.00mm_Horizontal

FP—

TerminalBlock_MetzConnect

terminal block Metz Connect Type094_RT03502HBLU, 2 pins, pitch 5mm, size 10x8.3mm, drill diameter 1.3mm, pad diameter 2.6mm, https://www.metz-connect.com/externalfiles/310941/863441.PDF

Pads
2
THT
11.0×9.3
Boards
10

TerminalBlock_Philmore_TB132_1x02_P5.00mm_Horizontal

FP—

TerminalBlock_Philmore

Terminal Block Philmore , 2 pins, pitch 5mm, size 10x10.2mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.philmore-datak.com/mc/Page%20197.pdf

Pads
2
THT
11.0×11.2
Boards
10

TerminalBlock_Xinya_XY308-2.54-4P_1x04_P2.54mm_Horizontal

FP—

TerminalBlock

Terminal Block Xinya XY308-2.54-4P, 4 pins, pitch 2.54mm, size 10.7x6.5mm, drill diameter 1.2mm, pad diameter 2mm, http://www.xinyaelectronic.com/product/xy308-254

Pads
4
THT
11.7×7.5
Boards
10

TestPoint_THTPad_D4.0mm_Drill2.0mm

FP—

TestPoint

THT pad as test Point, diameter 4.0mm, hole diameter 2.0mm

Pads
1
THT
5.0×5.0
Boards
10

D_1210_3225Metric_Pad1.42x2.65mm_HandSolder

FP—

Diode_SMD

Diode SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
4.9×3.2
Boards
9

D_2512_6332Metric_Pad1.52x3.35mm_HandSolder

FP—

Diode_SMD

Diode SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
8.0×3.9
Boards
9

Fuse_2512_6332Metric_Pad1.52x3.35mm_HandSolder

FP—

Fuse

Fuse SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
8.0×3.9
Boards
9

BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads
121
SMD
11.0×11.0
Boards
9

DFN-8_2x2mm_P0.5mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; No exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF

Pads
8
SMD
3.3×2.7
Boards
9

Texas_S-PVQFN-N14

FP3D

Package_DFN_QFN

Texas_S-PVQFN-N14 http://www.ti.com/lit/ds/symlink/txb0104.pdf

Pads
15
SMD
4.8×4.8
Boards
9

Diodes_PSOP-8

FP—

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf)

Pads
9
SMD
7.4×5.4
Boards
9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
17
SMD
7.8×5.5
Boards
9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)

Pads
17
SMD
7.0×5.7
Boards
9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads
33
SMD
9.0×11.6
Boards
9

Altech_AK300_1x03_P5.00mm_45-Degree

FP3D

TerminalBlock_Altech

Terminal block Altech AK300, 45Degree (cable under 45degree), 3 pins, pitch 5mm, size 15x12.5mm, drill diameter 1.3mm, pad diameter 3mm, https://www.altechcorp.com/PDFS/PCBMETRC.PDF#page=5

Pads
3
THT
16.0×13.5
Boards
9

L_1806_4516Metric_Pad1.45x1.90mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 1806 (4516 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)

Pads
2
SMD
6.4×2.4
Boards
8

MountingHole_2.2mm_M2_ISO14580_Pad_TopBottom

FP—

MountingHole

Mounting Hole 2.2mm, M2, generated by kicad-footprint-generator mountinghole.py

Pads
1
THT
4.3×4.3
Boards
8