Footprints
2,987 footprints matching “P1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BGA-196_15x15mm_Layout14x14_P1.0mm
Package_BGA
BGA-196, 15.0x15.0mm, 196 Ball, 14x14 Layout, 1.0mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/VMDS-10502.pdf#page=99
- Pads
- 196
- SMD
- 17.0×17.0
- Boards
- —
BGA-24_8x8mm_Layout5x5_P1.0mm
Package_BGA
BGA-24, 8x8mm, 24 Ball, 5x5 Layout, 1.0mm Pitch, https://www.infineon.com/assets/row/public/packages/73/package_outline_download/infineon-pg-bga-24-804-spo-pdf-package-en.pdf
- Pads
- 24
- SMD
- 10.0×10.0
- Boards
- —
BGA-25_6.35x6.35mm_Layout5x5_P1.27mm
Package_BGA
BGA-25, https://www.analog.com/media/en/technical-documentation/data-sheets/ltm4624.pdf
- Pads
- 25
- SMD
- 8.2×8.2
- Boards
- —
BGA-324_19.0x19.0mm_Layout18x18_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
BGA-324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00233-03.pdf
- Pads
- 324
- SMD
- 21.0×21.0
- Boards
- —
BGA-352_35.0x35.0mm_Layout26x26_P1.27mm
Package_BGA
BGA-352, https://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/b352p05.pdf
- Pads
- 352
- SMD
- 37.0×37.0
- Boards
- —
BGA-672_27.0x27.0mm_Layout26x26_P1.0mm_Ball0.6mm_Pad0.5mm_NSMD
Package_BGA
Altera BGA-672, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00472-00.pdf
- Pads
- 672
- SMD
- 29.0×29.0
- Boards
- —
BGA-676_27.0x27.0mm_Layout26x26_P1.0mm_Ball0.6mm_Pad0.5mm_NSMD
Package_BGA
XILINX BGA-676, https://www.xilinx.com/support/documentation/package_specs/fg676.pdf
- Pads
- 676
- SMD
- 29.0×29.0
- Boards
- —
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
Linear_BGA-133_15.0x15.0mm_Layout12x12_P1.27mm
Package_BGA
Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf
- Pads
- 134
- SMD
- 17.0×17.0
- Boards
- —
Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm
Package_BGA
FCG1152, 35.0x35.0mm, 1152 Ball, 34x34 Layout, 1.0mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 1152
- SMD
- 37.0×37.0
- Boards
- —
Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm
Package_CSP
LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)
- Pads
- 5
- SMD
- 4.0×3.5
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm
Package_CSP
16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- —
LFCSP-8-1EP_3x2mm_P0.5mm_EP1.6x1.65mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf
- Pads
- 9
- SMD
- 3.8×2.6
- Boards
- —
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
AO_AOZ666xDI_DFN-8-1EP_3x3mm_P0.65mm_EP1.25x2.7mm
Package_DFN_QFN
AO AOZ666xDI DFN, 8 Pin (https://aosmd.com/res/data_sheets/AOZ6663DI-01.pdf#page=15)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —