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Footprints

372 footprints matching “DIL”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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SymbolFootprint3D model

Footprints on their own, whether or not a symbol uses them.

372 footprints · page 6 of 16

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SMDIP-8_W9.53mm_Clearance8mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads
8
SMD
11.5×10.7
Boards
2

3M_Textool_240-1288-00-0602J_2x20_P2.54mm

FP—

Socket

3M 40-pin zero insertion force socket, though-hole, row spacing 25.4 mm (1000 mils)

Pads
40
THT
23.9×66.8
Boards
2

Diode_Bridge_Diotec_MicroDil_3.0x3.0x1.8mm

FP3D

Diode_SMD

SMD package Diotec Diotec MicroDil, body 3.0x3.0x1.8mm (e.g. diode bridge), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/mys40.pdf

Pads
4
SMD
6.1×3.5
Boards
1

CERDIP-14_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
14
THT
10.5×19.6
Boards
1

CERDIP-16_W7.62mm_SideBrazed

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
16
THT
9.7×20.8
Boards
1

CERDIP-16_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
16
THT
10.7×20.9
Boards
1

CERDIP-18_W7.62mm_SideBrazed

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
18
THT
9.7×23.4
Boards
1

CERDIP-20_W7.62mm_SideBrazed

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
20
THT
9.7×25.9
Boards
1

CERDIP-20_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
20
THT
10.5×25.9
Boards
1

CERDIP-20_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
20
THT
10.7×26.0
Boards
1

DIP-10_W10.16mm_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads
10
THT
13.1×13.2
Boards
1

DIP-10_W7.62mm_Socket

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads
10
THT
10.7×13.3
Boards
1

DIP-12_W10.16mm_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads
12
THT
13.1×15.7
Boards
1

DIP-12_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads
12
SMD
10.7×15.9
Boards
1

DIP-12_W7.62mm_Socket

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads
12
THT
10.7×15.9
Boards
1

DIP-12_W7.62mm_Socket_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads
12
THT
10.7×15.9
Boards
1

DIP-12_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads
12
SMD
12.5×15.9
Boards
1

DIP-20_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads
20
SMD
12.5×26.0
Boards
1

DIP-22_W10.16mm

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
22
THT
12.3×28.4
Boards
1

DIP-22_W10.16mm_Socket

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket

Pads
22
THT
13.2×28.6
Boards
1

DIP-22_W7.62mm_Socket

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads
22
THT
10.7×28.6
Boards
1

DIP-24_18.0mmx34.29mm_W15.24mm

FP—

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils) https://www.mouser.at/datasheet/2/389/m48t02-1849963.pdf

Pads
24
THT
18.5×34.8
Boards
1

DIP-24_W10.16mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
24
THT
12.3×31.0
Boards
1

DIP-28_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads
28
SMD
20.1×36.2
Boards
1