Footprints
106 footprints matching “PITCH,”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm
Package_CSP
WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf
- Pads
- 20
- SMD
- 3.9×4.4
- Boards
- 3
WLCSP-6_1.4x1.0mm_P0.4mm
Package_CSP
6pin Pitch 0.4mm
- Pads
- 6
- SMD
- 1.9×1.5
- Boards
- 2
ST_WLCSP-49_Die447
Package_CSP
WLCSP-49, 3.294x3.258mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l072kz.pdf#page=134
- Pads
- 49
- SMD
- 5.3×5.3
- Boards
- 1
Anpec_WLCSP-20_1.76x2.03mm_Layout4x5_P0.4mm
Package_CSP
WLCSP-20, 1.76x2.03mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.lcsc.com/datasheet/lcsc_datasheet_2007032014_Anpec-Elec-APW7261HAI-TRG_C691404.pdf
- Pads
- 20
- SMD
- 3.8×4.0
- Boards
- —
Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm
Package_CSP
Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet
- Pads
- 34
- SMD
- 6.5×3.7
- Boards
- —
DiodesInc_GEA20_WLCSP-20_1.7x2.1mm_Layout4x5_P0.4mm
Package_CSP
Diodes Incorporated WLCSP-20, GEA20, 1.7x2.1mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.diodes.com/assets/Package-Files/GEA20.pdf
- Pads
- 20
- SMD
- 3.7×4.1
- Boards
- —
Efinix_WLCSP-64_3.5353x3.3753mm_Layout8x8_P0.4mm
Package_CSP
Efinix WLCSP, NSMD pad definition Page 60, 3.5353x3.3753mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf#page=9
- Pads
- 64
- SMD
- 5.5×5.4
- Boards
- —
Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm
Package_CSP
WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf
- Pads
- 80
- SMD
- 6.5×5.6
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm
Package_CSP
16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- —
LFCSP-8_2x2mm_P0.5mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf
- Pads
- 8
- SMD
- 2.8×2.6
- Boards
- —
LFCSP-8-1EP_3x2mm_P0.5mm_EP1.6x1.65mm
Package_CSP
LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf
- Pads
- 9
- SMD
- 3.8×2.6
- Boards
- —
LFCSP-VQ-24-1EP_4x4mm_P0.5mm_EP2.642x2.642mm
Package_CSP
LFCSP VQ, 24 pin, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf)
- Pads
- 25
- SMD
- 5.1×5.1
- Boards
- —
Macronix_WLCSP-12_2.02x2.09mm_Layout4x4_P0.5mm
Package_CSP
WLCSP-12, 2.02x2.09mm, 12 Ball, 4x4 Layout, 0.5mm Pitch, https://www.macronix.com/Lists/Datasheet/Attachments/8909/MX25U3232F,%201.8V,%2032Mb,%20v1.2.pdf#page=93
- Pads
- 12
- SMD
- 4.0×4.1
- Boards
- —
Maxim_WLCSP-35_2.998x2.168mm_Layout7x5_P0.4mm
Package_CSP
WLCSP-35, 2.998x2.168mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF
- Pads
- 35
- SMD
- 5.0×4.2
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm
Package_CSP
ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf
- Pads
- 100
- SMD
- 6.4×6.5
- Boards
- —
ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter
Package_CSP
ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf
- Pads
- 100
- SMD
- 6.4×6.4
- Boards
- —
ST_WLCSP-100_Die422
Package_CSP
WLCSP-100, 4.201x4.663mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f302vc.pdf#page=133
- Pads
- 100
- SMD
- 6.2×6.7
- Boards
- —