Footprints

65 footprints matching “Instruments”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

65 footprints · page 1 of 3

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Texas_DRT-3

FP3D

Package_TO_SOT_SMD

Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf

Pads: 3
SMD: 1.6×1.4
Boards: 39

Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias

FP—

Package_SO

Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)

Pads: 9
SMD: 7.5×5.5
Boards: 34

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 17
SMD: 7.8×5.5
Boards: 31

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm

FP—

Package_SO

Pads: 17
SMD: 7.8×5.5
Boards: 9

SOIC-8_5.3x6.2mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)

Pads: 8
SMD: 9.4×6.7
Boards: 8

VSONP-8-1EP_5x6_P1.27mm

FP—

Package_SON

SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf)

Pads: 3
SMD: 6.8×5.4
Boards: 7

Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm

FP—

Package_SO

Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)

Pads: 9
SMD: 7.5×5.5
Boards: 5

Texas_DSBGA-9_1.62x1.58mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.62mmx1.58mm, area grid, NSMD, YZF0009 pad definition, 1.62x1.58mm, 9 Ball, 3x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ml/mxbg027n/mxbg027n.pdf

Pads: 9
SMD: 3.6×3.6
Boards: 4

Texas_B3QFN-14-1EP_5x5.5mm_P0.65mm_ThermalVia

FP—

Package_DFN_QFN

Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf

Pads: 15
SMD: 5.9×6.0
Boards: 4

Texas_MOF0009A

FP—

Package_DFN_QFN

Texas Instruments, QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf)

Pads: 9
SMD: 6.5×8.5
Boards: 4

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm

FP—

Package_SO

Pads: 9
SMD: 7.4×5.4
Boards: 4

Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm

FP—

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf

Pads: 6
SMD: 3.0×3.5
Boards: 3

Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 8
SMD: 2.9×3.9
Boards: 3

Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 8
SMD: 3.4×3.4
Boards: 3

Texas_DSBGA-9_1.4715x1.4715mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 9
SMD: 3.5×3.5
Boards: 3

WQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm

FP—

Package_DFN_QFN

QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf)

Pads: 33
SMD: 5.9×5.9
Boards: 3

Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelC

FP—

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf

Pads: 6
SMD: 1.9×2.3
Boards: 2

Texas_DSBGA-8_0.705x1.468mm_Layout2x4_P0.4mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, NSMD, YBJ0008 pad definition, 0.705x1.468mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234

Pads: 8
SMD: 2.7×3.5
Boards: 2

Texas_REF0038A_WQFN-38-2EP_6x4mm_P0.4

FP—

Package_DFN_QFN

Texas REF0038A WQFN, 38 Pin, 2EP (https://www.ti.com/lit/ds/symlink/tps25730.pdf#page=68)

Pads: 34
SMD: 6.9×4.9
Boards: 2

Texas_PWP0020A

FP3D

Package_SO

20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)

Pads: 21
SMD: 8.2×7.0
Boards: 2

Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads: 12
SMD: 3.4×3.9
Boards: 1

Texas_DSBGA-5_0.822x1.116mm_Layout2x1x2_P0.4mm

FP—

Package_BGA

Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 5
SMD: 2.8×3.1
Boards: 1