Footprints

353 footprints matching “bga”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints on their own, whether or not a symbol uses them.

353 footprints · page 10 of 15

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FCPBGA-780_23x23mm_Layout28x28_P0.8mm

Package_BGA

FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf

Pads: 780
SMD: 25.0×25.0
Boards: —

Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm

Package_BGA

WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf

Pads: 8
SMD: 4.3×5.1
Boards: —

Infineon_LFBGA-292_17x17mm_Layout20x20_P0.8mm

Package_BGA

Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/

Pads: 292
SMD: 19.0×19.0
Boards: —

Infineon_TFBGA-48_6x10mm_Layout6x8_P0.75mm

Package_BGA

Cypress / Infineon TFBGA-48, NSMD, 6.0x10.0mm, 48 Ball, 6x8 Layout, 0.75mm Pitch, https://www.infineon.com/dgdl/Infineon-CY14U256LA_256-Kbit_(32_K_8)_nvSRAM-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec0a9c33546

Pads: 48
SMD: 8.0×12.0
Boards: —

Lattice_caBGA-381_17x17mm_Layout20x20_P0.8mm_SMD

Package_BGA

Lattice caBGA-381, ECP5 FPGAs, 17.0x17.0mm, 381 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads: 381
SMD: 19.0×19.0
Boards: —

Lattice_caBGA-756_27x27mm_Layout32x32_P0.8mm

Package_BGA

Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads: 756
SMD: 29.0×29.0
Boards: —

Lattice_iCE40_csBGA-132_8x8mm_Layout14x14_P0.5mm

Package_BGA

Lattice csBGA-132, Option 2, iCE40 FPGAs, 8.0x8.0mm, 132 Ball, 14x14 Layout, 0.5mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads: 132
SMD: 10.0×10.0
Boards: —

LFBGA-153_11.5x13mm_Layout14x14_P0.5mm

Package_BGA

JEDEC eMMC AN BGA-153, 11.5x13.0mm, 153 Ball, 14x14 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 153
SMD: 13.5×15.0
Boards: —

LFBGA-169_12x16mm_Layout14x28_P0.5mm

Package_BGA

JEDEC eMMC AA BGA-169, 12.0x16.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 169
SMD: 14.0×18.0
Boards: —

LFBGA-169_12x18mm_Layout14x28_P0.5mm

Package_BGA

JEDEC eMMC AB BGA-169, 12.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 169
SMD: 14.0×20.0
Boards: —

LFBGA-169_14x18mm_Layout14x28_P0.5mm

Package_BGA

JEDEC eMMC AC BGA-169, 14.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 169
SMD: 16.0×20.0
Boards: —

LFBGA-289_14x14mm_Layout17x17_P0.8mm

Package_BGA

LFBGA-289, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp131c.pdf

Pads: 289
SMD: 16.0×16.0
Boards: —

LFBGA-400_16x16mm_Layout20x20_P0.8mm

Package_BGA

LFBGA-400, NSMD, 16.0x16.0mm, 400 Ball, 20x20 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf

Pads: 400
SMD: 18.0×18.0
Boards: —

LFBGA-484_18x18mm_Layout22x22_P0.8mm

Package_BGA

LFBGA-484, NSMD, 18.0x18.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf

Pads: 484
SMD: 20.0×20.0
Boards: —

Linear_BGA-133_15.0x15.0mm_Layout12x12_P1.27mm

Package_BGA

Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads: 134
SMD: 17.0×17.0
Boards: —

MAPBGA-272_9x9mm_Layout17x17_P0.5mm

Package_BGA

MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1

Pads: 272
SMD: 11.0×11.0
Boards: —

MAPBGA-289_14x14mm_Layout17x17_P0.8mm

Package_BGA

MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1

Pads: 289
SMD: 16.0×16.0
Boards: —

Maxim_WLP-12

Package_BGA

Maxim_WLP-12 W121B2+1 http://pdfserv.maximintegrated.com/package_dwgs/21-0009.PDF

Pads: 12
SMD: 4.0×3.6
Boards: —

Maxim_WLP-12_2.008x1.608mm_Layout4x3_P0.4mm

Package_BGA

Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF

Pads: 12
SMD: 4.0×3.6
Boards: —

Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm

Package_BGA

FCG1152, 35.0x35.0mm, 1152 Ball, 34x34 Layout, 1.0mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 1152
SMD: 37.0×37.0
Boards: —

Microchip_FCSG325_BGA-325_11x11mm_Layout21x21_P0.5mm

Package_BGA

FCSG325, 11.0x11.0mm, 325 Ball, 21x21 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 325
SMD: 13.0×13.0
Boards: —

Microchip_FCSG536_BGA-536_16x16mm_Layout30x30_P0.5mm

Package_BGA

FCSG536, 16.0x16.0mm, 536 Ball, 30x30 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 536
SMD: 18.0×18.0
Boards: —

Microchip_FCVG484_BGA-484_19x19mm_Layout22x22_P0.8mm

Package_BGA

FCVG484, 19.0x19.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 484
SMD: 21.0×21.0
Boards: —

Microchip_FCVG784_BGA-784_23x23mm_Layout28x28_P0.8mm

Package_BGA

FCVG784, 23.0x23.0mm, 784 Ball, 28x28 Layout, 0.8mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 784
SMD: 25.0×25.0
Boards: —