Footprints

353 footprints matching “bga”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

353 footprints · page 15 of 15

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Xilinx_RF1157_RF1158

FP—

Package_BGA

Virtex-7 BGA, NSMD pad definition Appendix A, 35x35mm, 1156 Ball, 34x34 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305

Pads: 1156
SMD: 37.0×37.0
Boards: —

Xilinx_RF1761

FP—

Package_BGA

Virtex-7 BGA, NSMD pad definition Appendix A, 42.5x42.5mm, 1760 Ball, 42x42 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306

Pads: 1760
SMD: 44.5×44.5
Boards: —

Xilinx_RF1930

FP—

Package_BGA

Virtex-7 BGA, NSMD pad definition Appendix A, 45x45mm, 1924 Ball, 44x44 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307

Pads: 1924
SMD: 47.0×47.0
Boards: —

Xilinx_RF676

FP—

Package_BGA

Kintex-7 BGA, NSMD pad definition Appendix A, 27x27mm, 676 Ball, 26x26 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297

Pads: 676
SMD: 29.0×29.0
Boards: —

Xilinx_RF900

FP—

Package_BGA

Kintex-7 and Zynq-7000 BGA, NSMD pad definition Appendix A, 31x31mm, 900 Ball, 30x30 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94

Pads: 900
SMD: 33.0×33.0
Boards: —

Xilinx_RFG676

FP—

Package_BGA

Zynq-7000 BGA, NSMD pad definition Appendix A, 27x27mm, 676 Ball, 26x26 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93

Pads: 676
SMD: 29.0×29.0
Boards: —

Xilinx_RS484

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279

Pads: 484
SMD: 21.0×21.0
Boards: —

Xilinx_SBG484

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270

Pads: 484
SMD: 21.0×21.0
Boards: —

Xilinx_SBG485

FP—

Package_BGA

Zynq-7000 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80

Pads: 484
SMD: 21.0×21.0
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads: 8
SMD: 5.2×5.2
Boards: —

WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm

FP—

Package_CSP

WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf

Pads: 56
SMD: 5.2×5.5
Boards: —

WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm

FP3D

Package_CSP

ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23

Pads: 6
SMD: 3.5×3.1
Boards: —