Footprints

284 footprints matching “chip”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

284 footprints · page 11 of 12

Matched by name and keywords. Search by meaning instead

R_0402x4

FP—

jlcpcb-JLCPCB

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA04P (see cra04p.pdf)

Pads: 8
SMD: 1.5×2.0
Boards: —

R_0603x4

FP—

jlcpcb-JLCPCB

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)

Pads: 8
SMD: 3.1×3.8
Boards: —

Lite-On_LTR-303ALS-01

FP—

kiml-00-kiml-optical

ambient light sensor, i2c interface, 6-pin chipled package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf

Pads: 6
SMD: 3.0×2.5
Boards: —

Lite-On_LTR-303ALS-01

FP—

kiml-00-kiml-unsorted

ambient light sensor, i2c interface, 6-pin chipled package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf

Pads: 6
SMD: 3.0×2.5
Boards: —

RTL8188_module

FP—

muratovas-MAS_Package_nostd

SINGLE-CHIP IEEE 802.11b/g/n 1T1R WLAN CONTROLLER WITH USB2.0 INTERFACE

Pads: 6
SMD: 14.0×13.2
Boards: —

L_Array_Concave_4x0402

FP3D

muratovas-MAS_Package_std

Chip Common Mode Choke Coil Arrays

Pads: 8
SMD: 2.0×2.5
Boards: —

Broadcom_APDS-9301

FP—

OptoDevice

ambient light sensor, i2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN

Pads: 6
SMD: 3.1×3.8
Boards: —

Osram_SFH3710

FP—

OptoDevice

Osram SHF3710 NPN phototransistor, SMD Chip LED package, 2.0 x 1.25mm, height 0.85mm, https://look.ams-osram.com/m/14a91a7e00106d22/original/SFH-3710.pdf

Pads: 2
SMD: 3.7×1.8
Boards: —

Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm

FP—

Package_BGA

FCG1152, 35.0x35.0mm, 1152 Ball, 34x34 Layout, 1.0mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 1152
SMD: 37.0×37.0
Boards: —

Microchip_FCSG325_BGA-325_11x11mm_Layout21x21_P0.5mm

FP—

Package_BGA

FCSG325, 11.0x11.0mm, 325 Ball, 21x21 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 325
SMD: 13.0×13.0
Boards: —

Microchip_FCSG536_BGA-536_16x16mm_Layout30x30_P0.5mm

FP—

Package_BGA

FCSG536, 16.0x16.0mm, 536 Ball, 30x30 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 536
SMD: 18.0×18.0
Boards: —

Microchip_FCVG484_BGA-484_19x19mm_Layout22x22_P0.8mm

FP—

Package_BGA

FCVG484, 19.0x19.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 484
SMD: 21.0×21.0
Boards: —

Microchip_FCVG784_BGA-784_23x23mm_Layout28x28_P0.8mm

FP—

Package_BGA

FCVG784, 23.0x23.0mm, 784 Ball, 28x28 Layout, 0.8mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 784
SMD: 25.0×25.0
Boards: —

Microchip_TFBGA-196_11x11mm_Layout14x14_P0.75mm_SMD

FP—

Package_BGA

TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956

Pads: 196
SMD: 13.0×13.0
Boards: —

TFBGA-644_19x19mm_Layout28x28_P0.65mm

FP3D

Package_BGA

TFBGA-636, 19.0x19.0mm, 644 Ball, 28x28 Layout, 0.65mm Pitch, https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF

Pads: 644
SMD: 21.0×21.0
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm

FP—

Package_CSP

16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)

Pads: 17
SMD: 4.2×4.2
Boards: —

LFCSP-72-1EP_10x10mm_P0.5mm_EP6.15x6.15mm

FP—

Package_CSP

72-Lead Frame Chip Scale Package - 10x10x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf)

Pads: 73
SMD: 10.9×10.9
Boards: —

Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm

FP—

Package_CSP

Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf

Pads: 15
SMD: 4.4×3.2
Boards: —

WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm

FP3D

Package_CSP

ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23

Pads: 6
SMD: 3.5×3.1
Boards: —